Quality and Reliability SoC Engineer

We are seeking an experienced and driven Quality and Reliability (Q&R) Engineer  to own and manage the qualification and long-term reliability of advanced automotive semiconductor products. In this role, you will be responsible for defining, executing, and ensuring product compliance with industry standards (e.g., AEC-Q100, JEDEC, ISO26262), collaborating cross-functionally with design, test, packaging, and manufacturing teams to ensure robust quality performance throughout the product lifecycle.

What your job will look like:

• Lead end-to-end quality and reliability activities for new automotive product introductions (NPI), including definition of Q&R plans, stress test strategy, and execution of qualification.
• Define and align qualification strategy with AEC-Q100, JEDEC (JESD22), and customer-specific requirements.
• Drive reliability risk assessments (FMEA, FMEDA, fault tree analysis) in collaboration with functional safety and design teams.
• Manage product qualification timelines, budgets, and documentation, including reliability test reports, risk mitigation plans, and deviation justifications.
• Interface with OSATs and test/assembly partners to ensure reliability test execution, including HTOL, ELFR, HAST, PTC, HTSL, and solder joint reliability.
• Lead root cause analysis and corrective actions for product or qualification-related failures (FA/8D process).
• Act as the Q&R voice in cross-functional reviews (DFX, tape-out, production ramp, and PCN).
• Track field returns, drive reliability monitoring, and contribute to continuous improvement activities.
• Support audits, customer quality inquiries, and product certifications as needed.

All you need is:

• B.Sc./M.Sc. in Electrical Engineering, Materials Science, Physics, or related technical field.
• 5+ years of experience in semiconductor quality/reliability, preferably in automotive-grade ICs or modules.
• Strong knowledge of AEC-Q100, JEDEC standards (e.g., JESD47, JESD22), and automotive PPAP/APQP process.
• Hands-on experience with reliability testing, failure analysis techniques, and qualification management.
• Familiarity with packaging-related reliability (FCBGA, FCCSP, WLCSP, QFN) and stress mechanisms (solder fatigue, moisture sensitivity, ESD/LU).
• Proven ability to work across multidisciplinary teams (design, test, process, FA, packaging).
• Excellent communication, organizational, and problem-solving skills.
• Experience with radar, vision, or ADAS automotive products- Advantage